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      PRODUCT >Laminated molded products series

    Epoxy board

    Specification :0.5-0 .8 mm
    1-2mm
    3-55mm
        Description:
    This product is bonded with epoxy resin heated pressure produced in temperature mechanical properties, electrical properties and stability at high temperatures.
    Product Use:
    Applicable to mechanical, electrical and electronic high insulation parts with high mechanical and dielectric properties of good heat resistance and moisture resistance.
     

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